JPH01237073A - 再半田付け装置及びそれを用いた再半田付け方法 - Google Patents
再半田付け装置及びそれを用いた再半田付け方法Info
- Publication number
- JPH01237073A JPH01237073A JP6203088A JP6203088A JPH01237073A JP H01237073 A JPH01237073 A JP H01237073A JP 6203088 A JP6203088 A JP 6203088A JP 6203088 A JP6203088 A JP 6203088A JP H01237073 A JPH01237073 A JP H01237073A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wire
- tip
- soldering iron
- defective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
- H05K13/0491—Hand tools therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6203088A JPH01237073A (ja) | 1988-03-17 | 1988-03-17 | 再半田付け装置及びそれを用いた再半田付け方法 |
PCT/JP1989/000190 WO1989008527A1 (en) | 1988-03-17 | 1989-02-23 | Method and apparatus for removing defective solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6203088A JPH01237073A (ja) | 1988-03-17 | 1988-03-17 | 再半田付け装置及びそれを用いた再半田付け方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01237073A true JPH01237073A (ja) | 1989-09-21 |
JPH0258027B2 JPH0258027B2 (en]) | 1990-12-06 |
Family
ID=13188360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6203088A Granted JPH01237073A (ja) | 1988-03-17 | 1988-03-17 | 再半田付け装置及びそれを用いた再半田付け方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH01237073A (en]) |
WO (1) | WO1989008527A1 (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104475908A (zh) * | 2014-11-14 | 2015-04-01 | 柳州市安龙机械设备有限公司 | 自动焊枪 |
CN110977078A (zh) * | 2019-12-04 | 2020-04-10 | 曾招炜 | 一种异形电池输出导线焊接器 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5072874A (en) * | 1991-01-31 | 1991-12-17 | Microelectronics And Computer Technology Corporation | Method and apparatus for using desoldering material |
CN104439596A (zh) * | 2014-11-14 | 2015-03-25 | 柳州市安龙机械设备有限公司 | 焊枪 |
CN106392240B (zh) * | 2016-12-05 | 2018-07-31 | 辽宁工程技术大学 | 一种一体化锡焊手柄 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS517428U (en]) * | 1974-07-06 | 1976-01-20 | ||
JPS5490047A (en) * | 1977-11-08 | 1979-07-17 | Spirig Ernst | Apparatus for removing solder alloy |
JPS5588369U (en]) * | 1978-12-09 | 1980-06-18 | ||
JPS58119965U (ja) * | 1982-02-05 | 1983-08-16 | 大日機工株式会社 | 産業用ロボツトのはんだ付用ハンド |
JPS60166465U (ja) * | 1984-04-13 | 1985-11-05 | 日本電気株式会社 | 万能はんだごて |
JPS62137667U (en]) * | 1986-02-25 | 1987-08-29 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5543657U (en]) * | 1978-09-13 | 1980-03-21 | ||
JPS60121067A (ja) * | 1983-12-01 | 1985-06-28 | Mitsubishi Electric Corp | ハンダ自動供給装置付ハンダごて |
JPS61200649U (en]) * | 1985-06-04 | 1986-12-16 |
-
1988
- 1988-03-17 JP JP6203088A patent/JPH01237073A/ja active Granted
-
1989
- 1989-02-23 WO PCT/JP1989/000190 patent/WO1989008527A1/ja unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS517428U (en]) * | 1974-07-06 | 1976-01-20 | ||
JPS5490047A (en) * | 1977-11-08 | 1979-07-17 | Spirig Ernst | Apparatus for removing solder alloy |
JPS5588369U (en]) * | 1978-12-09 | 1980-06-18 | ||
JPS58119965U (ja) * | 1982-02-05 | 1983-08-16 | 大日機工株式会社 | 産業用ロボツトのはんだ付用ハンド |
JPS60166465U (ja) * | 1984-04-13 | 1985-11-05 | 日本電気株式会社 | 万能はんだごて |
JPS62137667U (en]) * | 1986-02-25 | 1987-08-29 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104475908A (zh) * | 2014-11-14 | 2015-04-01 | 柳州市安龙机械设备有限公司 | 自动焊枪 |
CN110977078A (zh) * | 2019-12-04 | 2020-04-10 | 曾招炜 | 一种异形电池输出导线焊接器 |
CN110977078B (zh) * | 2019-12-04 | 2021-05-25 | 绍兴柯桥星蓝能环境科技有限公司 | 一种异形电池输出导线焊接器 |
Also Published As
Publication number | Publication date |
---|---|
JPH0258027B2 (en]) | 1990-12-06 |
WO1989008527A1 (en) | 1989-09-21 |
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